For housing | - |
Perforation | without |
Material | Aluminium |
Type of surface |
black anodised
solderable |
Thread | - |
Over 100 SMD heat sinks for SO, PLCC, PGA and BGA casing with eloxed and solderable (ICK SMDA 5...13, ICK SMD F 8/10) surface, as well as heat conducting cement (WLK 5) and double-sided adhesive, heat conducting foil (WLF R 25 x 130 mm).