175-59-016,Heat sink 23 mm 22.5 K/W black anodised, ICK BGA 23 X 23, Fischer Elektronik
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ICK BGA 23 X 23 - 

Heat sink 23 mm 22.5 K/W black anodised, ICK BGA 23 X 23, Fischer Elektronik

Fischer Elektronik ICK BGA 23 X 23
声明：图片仅供参考，请以实物为准！
制造商产品编号：
ICK BGA 23 X 23
仓库库存编号：
175-59-016
技术数据表：
View ICK BGA 23 X 23 Datasheet Datasheet
订购热线： 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于产品数据库庞大，部分产品信息可能未能及时更新，下单前请与销售人员确认好实时在库数量，谢谢合作！

ICK BGA 23 X 23技术参数

For housing BGA
Thermal resistance 22.5 K/W
Perforation without
Material Aluminium
Type of surface black anodised

ICK BGA 23 X 23产品信息

Length 23 mm
Width 23 mm
Height 6 mm
Thread -
Related Manufacturers: Molex | TE Connectivity | Hammond | Würth Elektronik | Fibox
Related Categories: Heat Sinks | Industrial Connectors | Installation Materials for Discrete Semiconductors | Enclosures | Assembly Material for Semiconductors
Related Products: Heat sink 19.1 mm 27.3 K/W black anodised | Heat sink 28 mm 17 K/W black anodised | Heat sink 19.1 mm 27.3 K/W black anodised | Heat sink 19.1 mm 27.3 K/W black anodised | Heat sink 5 mm 123 K/W black anodised
电话:400-900-3095
QQ:800152669

ICK BGA 23 X 23Family Information

  • Particularly suited for Ball Grid Arrays
  • Heatsink dimensions match the respective BGA type

ICK BGA 23 X 23产地与重量

Country of origin Germany (DE)
Manufacturer Fischer Elektronik
Gross weight (incl. package) 3.0 Gram
Dimensions (incl. package) 23 x 6 x 23 MM
Customs number 7616999099
UNSPSC (v5.03) 32131001
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